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October 1999

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Subject:
From:
Michael Fenner <[log in to unmask]>
Reply To:
Michael Fenner <[log in to unmask]>
Date:
Sat, 9 Oct 1999 11:51:27 +0100
Content-Type:
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text/plain (67 lines)
Remember that you are not just concerned to measure temperature as the board passes
through the system, but to ensure that all parts of the board go through the same profile.
A surprising number of people forget this. In other words plot different points on the
board. If your machine is very small then it may be a good idea not  to just run one test
board, but to check out what happens when you run a few down ahead of your test board to
see what effect a "production run" has. You may find a minumum spacing is desirable to
maintain your test/ideal profile.

Mike Fenner

----- Original Message -----
From: West, Jim <[log in to unmask]>
To: <[log in to unmask]>
Sent: 08 October 1999 21:47
Subject: [TN] Profiling


> Hi everyone,
>
> We are a small(low to medium) assembler and we have a small 3 zone table top
> reflow oven for our soldering process.  I have been doing the old trial and
> error routine and making temperature adjustments and conveyor speed
> adjustments to achieve good solder joints.  I have been wanting to check my
> profile, but I don't have the fancy equipment to do so.  I do however have a
> meter that reads temperature and a K-type thermocouple that I could run
> through with the board by attaching the thermocouple with high temp solder.
> I need help on the proper procedure for doing this and any ideas or
> concerns.  Also, what is out there on the market that is simple and not
> expensive(if anything), that I can use to do profiling?  What do you guys
> recommend?  What is everyone using to do profiling?
>
>
>
> Thanks,
>
> Jim West
> Manufacturing Engineer
>
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