It depends very much, of course, on board material and quality, especially
plating quality and thickness, plus the skill and care of your operators.
In the aerospace world (my bit of it anyway), we try not to rework a
location more than three times, and review the board's condition after that
if we want to do further rework to the same locations.

We look for pad damage, lack of pad adhesion to board surface, and solder
joint condition to see if we'll still get adequate wetting for another
rework. In general, if you're careful, barrel damage should not be so much
of an issue - it's usually the pads that suffer most.

Peter



Victor Hernandez <[log in to unmask]>  19/12/2002 09:54 PM
Sent by: TechNet <[log in to unmask]>

Please respond to "TechNet E-Mail Forum."; Please respond to
Victor_G_Hernandez

              To:  [log in to unmask]
              cc:  (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
              Subject: [TN] PCB Repair Criteria








> Fellow TechNetters,
>
>       Can some one assist me with this question.   How man times can a
PTH
> component be
safely removed before damage to the inner connections on the barrel occurs.

> Victor G. Hernandez
>

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