Hi,
see IPC-610 standards, component soldering spec.

Regards,
J.Janoch

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Baski Devre
Sent: Wednesday, April 06, 2005 3:59 PM
To: [log in to unmask]
Subject: [TN] incomplete wetting

Dear All

We have been shipping OSP covered PCBs to our customers.There is a
component
having 72 pads at 4 sides   dimensions of pads are 480X1500 microns the
distance between the pads are 500 microns. These pads are subjected to
cream
solder in customers production. As known that appertures on the stencils
are
produces smaller than the pads dimensions to release solder paste on the
pads. By considering these solder can not spread all over the pad during
soldering at customer side so pads have incomplete wetting apperance
because
appertures dimensions are smaller than pad dimensions. We have dispute
with
our customer about this issue. They want all the pad pitch to be
soldered.
So I want to learn about your comment on these incomplete wetting. Is it
always possible to solder all the pad in the customer side.



Yusuf GOMEC
Product Quality Engineer


BASKI DEVRE SAN. ve TIC. LTD. STI.
Ceyhan Sk. No:10 81490 Pendik-Istanbul-Turkey
Tel:0090 216 3901036(4 Line)/4836560(4 Line)
Fax:0090 216 3544941/4913269
Gsm:0090 533 6579897/7480014
Internet: www.baskidevre.com.tr

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