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June 1999

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Subject:
Re: stencil thickness
From:
Kathy Palumbo <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Kathy Palumbo" <[log in to unmask]>
Date:
Thu, 3 Jun 1999 20:06:06 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (67 lines) 
BALL GRID ARRAY

-----Original Message-----
From: Ko Adeline-FSGA2298 [mailto:[log in to unmask]]
Sent: Thursday, June 03, 1999 7:59 PM
To: [log in to unmask]
Subject: Re: [TN] stencil thickness


Hi,

May I know what is BGA?

Thanks & Best Rdgs
Adeline Ko

> -----Original Message-----
> From: Feng Yi,BISC PD IE(BJ) [SMTP:[log in to unmask]]
> Sent: Friday, June 04, 1999 10:49 AM
> To:   [log in to unmask]
> Subject:      [TN] stencil thickness
>
> Hi,
>
> We will make stencil for module with BGA, Fine pitch(0.4mm) and chip,
> because we knowed the requirement of stencil thickness it is 0.12mm for
> fine pitch(0.4mm), but it is 0.2mm for BGA, so we would like to know how
> thickness is stencil when there are both BGA and fine pitch.
>

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