TECHNET Archives

April 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Miguel Vallejo <[log in to unmask]>
Reply To:
Date:
Fri, 27 Apr 2007 10:12:34 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (35 lines)
Hi,

a customer asked us to assist in the adhesive selection for bonding the
following materials in the following order: FR4 chip to a Boron nitride
insulator to a 300 series stainless steel header. Also, the header has two
alloy 52 pins that go thru and solder to the FR4 chip.

 

The end-use environment is:

-65°F to +160°F

Aircraft vibration

Substantial shock

 

I would like to recommend a printable adhesive so I can use our SMT line to
assemble this part (including soldering). I’m currently looking at the
ablebond product, but would appreciate any suggestions on other product that
suits this application, thanks.


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2