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April 1997

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Subject:
Assy: Immersion gold vs. Hot air solder level
From:
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Date:
Tue, 1 Apr 1997 10:02:59 +0000
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Hello, 
I would appreciate comments and/or information on reference sources on
Immersion gold vs. Hot air solder level from SMT component assembly 
and solder point of view.
Thanks,
Francis Sun


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