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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 24 Sep 2003 13:38:41 -0700 |
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Hi,
I think the other important reason to use high-temp solder sphere on CBGA is because of the big CTE difference between FR-4 and ceramic. It provide more flexible joint. Same
reason as IBM CCGA packages which use high-temp solder column.
Regards,
Wei Wang
Werner Engelmaier wrote:
> Hi Victor,
> The reason for high-melt solder balls is the same as for solder
> columns--thicker solder connections (higher stand-off heights) provide higher reliability
> roughly by the square of the heights. This is well documented--just take one of
> my workshops.
>
> Regards,
> Werner Engelmaier
> Engelmaier Associates, L.C.
> Electronic Packaging, Interconnection and Reliability Consulting
> 7 Jasmine Run
> Ormond Beach, FL 32174 USA
> Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
> E-mail: [log in to unmask], Website: www.engelmaier.com
>
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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