The book The Mechanics of Solder Alloy Interconnects edited by Darrel
Frear et.al.
is worth reading. The book was published by Van Nostrand Reinhold, USA.
Chapter 8 is named Applications - Through Hole.

However, in our company we have the rule of thumb that the wall of
solder in a PTH should be kept within 2 - 5/10 mm on average.
A thinner wall may lead to brittle solder joint - most likely because of
intermetallics.
A thicker wall tends to be less strong also - most likely because of the
relatively large amount of "soft" solder alloy in the interconnection.


Best regards
Svend

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