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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 18 Nov 2002 08:59:51 +0800 |
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Jan,
I take it you mean electrically non-conductive rather than thermally
non-conductive? Filling holes in internal layers is often done with
high-resin content pre-preg. What is your application that this is not a
solution for you?
Peter
Jan Thuesen <[log in to unmask]> 15/11/2002 08:55 PM
Sent by: TechNet <[log in to unmask]>
Please respond to "TechNet E-Mail Forum."; Please respond to Jan Thuesen
To: [log in to unmask]
cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Subject: [TN] Via plugging
We need to plug vias on internal layers of 2,0 mm diameter. It has to be
with a non-conductive material. Do any of you have recommendations of a
hole
filling material with this capability. Most of the material for ordinary
innerlayer viaplugging has to low viscocity to provide a reliable fill.
Any input will be welcome.
With best regards
--
Jan Thuesen, Process Engineer
Chemitalic A/S
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