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October 1999

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Subject:
From:
Timothy Reeves <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Oct 1999 11:02:14 -0700
Content-Type:
text/plain
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text/plain (50 lines)
> I remember that the IPC sponsored a study which concluded that breakout
> was not a reliability concern, but I never actually saw the report...maybe
> you can still get it from them.
>
> Timothy Reeves
> ECD Circuit Board Division
> 13626 South Freeman Road
> Mulino, OR 97042
> [log in to unmask]
> (503) 829-9108 (800) 228-8198  FAX (503) 829-5482
>
>
>
> ----------
> From:         Ken Patel
> Sent:         Tuesday, October 12, 1999 3:50 PM
> Subject:      Reliability due to misregistration on inner layer
>
> On one of our product, we have found that one of the inner layer has
> misregistration.
>
> Do you see any quality/ long term reliability problem associated with
> inner
> layer misregistration? Our requirement was to have a 1 mil minimum annular
> ring on all inner layers. What is the risk cum liability of accepting
> those
> boards knowing that they are misregistered.
>
> Misregistration occurred at 1mm BGA where the finished hole diameter is 9
> mil on a 20 mil pads.
>
> re,
> ken patel
>
>

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