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February 2000

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Subject:
From:
Russell S Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 10 Feb 2000 17:38:59 EST
Content-Type:
text/plain
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All Immersion Tins do not contain Bismuth!
Bi causes problems with Lead Free Soldering and is not looked upon as an
option for the future in some quarters. 100% Pure Tin systems are available
that do not use an organic layer to prevent copper migration and therefore
work successfully to stop whisker formation. The systems using organics
cannot be controlled , and so if u do not have enough organic u do not know
until the bd is in the field and failing with whisker growth.

RG

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