Hello Ken

We had the same problem (or still have).
We tried HASL and OCC Boards but there was no difference. 
We also tried plugging with a special stencil and 63/37 but this don't
works.
We did not try a high temperature solder.
Masking is quite critical because of voids.
Beside redesign you have only one chance: Look for new process parameters.

Siggi


        ----------
        From:  Ken Patel [SMTP:[log in to unmask]]
        Sent:  Montag, 4. März 2002 23:37
        To:  [log in to unmask]
        Subject:  [TN] Via in Pad? Need Help!!!
        Importance:  High

        Guys,
        On our nickel gold board, solder joints are below IPC spec
(insufficient
        solder) where there are vias in pad. Solder is drained down the via
        holes and deprived the joint of necessary solder.  I would like to
know
        the following.
        (1) How about using the surface finish 63/37 coating HASL instead of
        Ni-Gold? I think gold dissolves in solder so quickly that I rather
use
        HASL processed boards, any thoughts?
        (2) Do you guys mask the via on bottom side to avoid solder draining
out
        on the other side?
        (3) Does anybody try Hi Temp solder paste to fill the vias as our
        assembly house ordered via stencils to fill the via using eutectic
        (63/37) solder paste which didn't work?

        Looking for
        re,
        Ken Patel

	
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