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July 2008

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Subject:
From:
Rex Waygood <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rex Waygood <[log in to unmask]>
Date:
Tue, 22 Jul 2008 13:25:36 +0100
Content-Type:
text/plain
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You should look up the spec of the specific device you are using. A
generic spec or national standard is no good. We have just had a similar
problem with a part and the data sheet only qualified the part for a
minimum of 50% of the thermal pad soldered. (And that was not the first
time we've had that constraint)

Looking at your X-Ray there were lots of 'thermal' vias and therefore it
appeared that the designer was very concerned about getting heat out.
Having only 33% coverage seemed low where so much attention had been
given to thermal vias.
Regards
Rex 


Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
Mob: +44 (0)7887 997403
 
[log in to unmask]
www.PartnerTech.co.uk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: 22 July 2008 13:04
To: [log in to unmask]
Subject: Re: [TN] Thermal header Solder attachment Guidelines

Rex & other contributors,

   You state " Many of these devices recommend a minimum of 50%. To me
that would be a more serious problem."   Where can I find related
articles and industry standard for this statement.

Victor,


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