Hi Matthias,
don't use anything "wet" or "chemical" or "plastic" on the bond pads! There will be a powerful reaction from jk or Mike F or worse..from Aussilek! We have exactly your wonderings in a line just now, to protect bond pads from flux splatting around during oven process. We simply let the robot drop a plastic cover down, because all bondings are concentrated to one area. After oven soldering, the cover is lifted away.  If your bond pads are spread out, of course this method doesn't work. May I ask what kind of wire bonding you aim at? If it's heavy wire bonding it should not be so sensitive to minor residues, thin gold wire more apt to disasters then. In principle, you should make your process such, that flux is stopped within such ranges that your bond pads are not involved. Well, to say more is not meaningful, I don't see your problem with a video camera, hope that comes soon in TechNet.

Cu

Ingemar Hernefjord
Ericsson Microwave Systems

I'm looking for a reliable process to protect wire bonding areas
(mostly immeesion NiAu for Al wire bonding) with something like a
temporary soldermask against any dirt from SMD process, instead of
expensive cleaning processes like plasma...

Thanks, regards
Matthias Mansfeld


-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://www.mansfeld-elektronik.de

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