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Date: | Wed, 3 Mar 2010 18:48:24 -0800 |
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Hello
Can you be more specific about your package design.
Just a curiosity, what do you mean by "a JEDEC tray of balled packages"?
You can get coplanarity from the PCB side using optical method.I have used Shadow Morie' before.With a accuracy of micron at room temperature.
Al
________________________________
From: Prashant Joshi <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, March 2, 2010 1:46:57 PM
Subject: [TN] BGA ball coplanarity inspection equipment
Hello,
I am looking for scanning equipment to measure flatness and coplanarity of
BGA packages and would appreciate recommendations. We would like to place
a JEDEC tray of balled packages and get readings for the whole tray in about a
minute. This is to support high volume manufacturing. Ball pitch could be 0.4 -
0.5 mm or higher. If you have a recommendation, will you please also share
what you like/dislike about it?
Thanks for your help,
Prashant Joshi
Interconnect Systems Inc.
(805) 482-2870
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