As our US Partnership for Assured Electronics team works on aspects of
Pb-free solders for Defense Electronics, the question came up about the
size limits for reballing from Pb-free back to eutectic solder balls.

Is there a lower limit of ball size where it becomes impossible to re-ball
for immediate use of the IC in Defense Electronics?  Is that because of the
ball sizes available, or are there equipment limitations in removal and
replacement?   Are there serious problems with flux in this fine pitch
application?

Thanks in advance
Denny Fritz
Consultant to USPAE team.

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Denny Fritz
Consultant
812 584 2687