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October 2005

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Subject:
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Wed, 12 Oct 2005 09:07:00 -0700
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There is an immersion Palladium process, putting Palladium only on to bare Copper, (3 millionths) which has been shown to give excellent results bonding to gold wire.

Information is available on this process off-Technet, drop me a note.

Rudy Sedlak
RD Chemical Company




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