The correct terms are "cupping" (corners of the BGA are higher than the
middle, and the corner balls are elongated) or "doming" (corners of BGA
are turned down, solder balls in corners are somewhat flattened, and
center solder balls are elongated). 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(AZ75)
Sent: Monday, March 06, 2006 11:56 AM
To: [log in to unmask]
Subject: Re: [TN] Warped BGA - Terminology

Interfacial.
Dewey 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
Sent: Monday, March 06, 2006 10:44 AM
To: [log in to unmask]
Subject: [TN] Warped BGA - Terminology

Hello TechNet,

What word or expression would you use to describe a warped BGA having:

1- elongated corner joints ("smiling")
2- elongated middle joints ("frowning")

Although the words into brackets are explicit, they look unofficial and
non-technical. Please provide me with more "official" alternatives.

Best regards.

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