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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Mon, 18 Dec 2006 21:05:26 -0500
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text/plain (174 lines)
I'll take a stab at answering the two questions you raise
Wayne,



I'll take a stab at answering the two questions you raised and also

correct one of the statements you made.



You indicated incorrectly that you "know that UL recently

"de-criminalized" ImAg, primarily based on IPC pressure."  The IPC

didn't pressure UL to "de-criminalize" immersion silver.  IPC member

companies who had experience with immersion silver surface finish on

PCBs jointed the IPC 3-11g sub-committee along with UL participation and

generated data that resulted in UL update the testing requirements that

were being imposed on silver finishes.  IPC and UL are organizations

that make specification changes based on data not pressure.  



As for why iNEMI hasn't "de-criminalized" there was no reason for them

to "de-criminalize" immersion silver because they had never

"criminalized" it.  If you look at the title of the paper written by the

iNEMI Tin Whisker User Group it covers "iNEMI Recommendations on

Lead-Free Finishes for Components Used in High-Reliability Products".

This group concentrated on component finishes not board finishes.  In

particular, if you look at Table 5 in their report that summarizes the

assessments of the individual members of the iNEMI Users Group relative

to PCB finishes you will see that there are no  tin whisker test

requirements for immersion silver.



As for papers on the electro-migration severity of immersion silver I

would start on the UL PCB site:

http://www.ul.com/pwb/silver.html



and then review the IPC 3-11g committee work.



Regards,

George

George M. Wenger

Andrew Corporation Wireless Network Solutions

Senior Principal FMA / Reliability Engineer

40 Technology Drive, Warren, NJ 07059

(908) 546-4531 [Office]  (732) 309-8964 [Cell]



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer

Sent: Monday, December 18, 2006 3:48 PM

To: [log in to unmask]

Subject: Re: [TN] iNEMI Hi rel Pb-free finish report



Sorry.  Here you go:



http://thor.inemi.org/webdownload/projects/ese/tin_whiskers/Pb-Free_Fini

shes_v4.pdf





Wayne



>>> [log in to unmask] 12/18/2006 2:57:21 pm >>>

Is the iNEMI 12/1/06 Pb-Free finish report published some

Wayne,



Is the iNEMI 12/1/06 Pb-Free finish report published somewhere?





Regards,

George

George M. Wenger

Senior Principle FMA / Reliability Engineer

Wireless network Solutions

Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908)

546-4531

[log in to unmask]





-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer

Sent: Monday, December 18, 2006 2:50 PM

To: [log in to unmask]

Subject: [TN] iNEMI Hi rel Pb-free finish report



In this report (dated 12/1/06) there are several cautions about

Immersion Ag due to electro-migration issues, particularly in

sulfurous

environments.



I know that UL recently "de-criminalized" ImAg, primarily based on IPC

pressure.  Why hasn't iNEMI?



Can anybody recommend a paper which explains the severity of this

electro-migration issue with respect to ImAg?



Thanks,



Wayne Thayer



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