I'm looking for input on the following plating defect.
I observe a plating void that occurs on a Cu plated feature with ENIG finish. The void goes down to the base material. The defect is typically .002 diameter. The feature size is .010 across. The parts run on a manual plating line and hang on a small plating rack.
The plating engineer believes the root cause of the void is a bubble on the part during plating. The action plan includes implementing stronger vibration on the part in the plating bath.
I have two questions.
1. How much vibration is typically needed to avoid developing a bubble on a part during plating?
2. For this plating void defect, is it possible that Ni corrosion or other reliability concerns would eventually develop if defective parts escaped?
Thank you,
Mark Julstrom
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