If you just had one device then hot bar reflow would be feasible. See
http://www.unitekequipment.com/
We use this equipment to join a flexi to a rigid. It isn't practical if
you have lots of devices.

Rex 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
Sent: 18 April 2006 15:56
To: [log in to unmask]
Subject: [TN] IR Reflow of small area?

Good morning,
 
We have a new board design that wants a simpler soldering method.  The
design will use TO-247 or TO-264 leaded devices with the leads lap
soldered to the circuit board.  What is the best way to easily solder
these to the board.  A traditional hand soldering iron is one way.  Is
there a way, other than wave or large oven reflow that will reduce my
manufacturing time?  IR reflow, hot jet... ?  Oh ya, the leads will be
soldered on the component side of the board and most other components
probably will be wave soldered thru-hole.
 
Thanks in advance.
 
Phil

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