TECHNET Archives

August 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Michael Fenner <[log in to unmask]>
Reply To:
Michael Fenner <[log in to unmask]>
Date:
Thu, 19 Aug 1999 13:59:03 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (165 lines)
I concur with Roger, hydrogen in plating is a likely answer. Sometimes it can be
baked out, but usually the answer is to strip/replate or replace.
Verify by baking out,  or using product from a previous batch without the problem. Or
mimic your process on any piece of unplated metal. [Changing nothing else.]

Mike Fenner
BSP, OX15 4JQ, England
T: +44 1295 722 992
M: +44 789 999 7715
F: +44 1295 720 937


-----Original Message-----
From: Roger Massey-G14195 <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: 12 August 1999 14:14
Subject: [TN] Re Ingemars question


>     Ingemar,
>
>        Strange question but ,does the adhesive film completely, or very
>     nearly cover the heat spreader, if not, are there microbubbles, or
>     surface voids occuring on the spreader itself but in areas not covered
>     with the adhesive?
>        If the adhesive film covers the spreader area, can you process some
>     blank heatspreaders, and take a look at them.
>
>        The reason I suggest this, and I dont know if you have already
>     followed this avenue, is that the platings you have described can
>     absorb Hydrogen during the plating operation, this will remain within
>     the plated layer until it gets nice and hot and then will bubble up
>     and make a nice mess of a flat surface.
>
>        A simple screening test by heat (300C for 1hr, or just use your
>     process oven) will allow the entrapped gas to escape, the bad thing is
>     that if the parts are suffering from this, there is nothing you can do
>     except send them back to the supplier, and ask that they strip and
>     replate them.  This is cheap test, and only needs a furnace and a
>     microscope.
>
>     Another potentially quicker way of doing this is to measure
>     microhardness of a good and bad part. the entrapped gas will harden
>     the Au and Ni plating if present.  Downer is that you need a
>     microhardness tester
>
>                Good Luck
>
>                Roger
>                Motorola AIEG
>
>
>______________________________ Reply Separator _________________________________
>Subject: Re: [TN] Where are the others?
>Author:  "TechNet E-Mail Forum." <[log in to unmask]> at #email
>Date:    12/08/99 14:14
>
>
>Sure, Graham,
>maybe some misunderstanding (joking must be correctly formulated), I
>don't mean to use french language, just tried to make a baite so someone
>from a french company came in. I'm still wondering why the french
>companies are so reserved in this forum.
>Now, Graham, forget my question, I leave the issue completely, instead I
>have something for you and possibly someone else: how do you 1)verify
>2)get rid of built-in gas or gas-creating micromaterial in a metal plate
>or a Au/Ni/Cu-Mo plate? We mount large semiconductor chips on
>heat-spreader by means of a thermoplastic film. The supplier of this film
>is one of the most familiar, they have specified Tg, outgassing, and all
>other chemical factors, and it seems as this film transer will not cause
>gas to grow under the chip during curing. But we get bubbles between the
>film and the heat spreader. The american thermoplastic film supplier has
>inspected our line and concept and he can't understand the bubble's
>origin. Can't be the transfer, he said.
>If extremly advanced or unusual equipments are needed for such
>evaluation, can you help us Graham? I can send a photo to you so you get
>more than words. Maybe IMAPS is a more correct adress for such
>questions, but I suspect many of you are in there too.
>
>Best wishes
>
>/Ingemar Hernefjord
>Ericsson Microwave Systems
>
>
>
>---------------------------separator---------------------------------
>> Ingemar,
>>
>> You know one of the major drawbacks of the whole "Internet" thing, is
>that
>> you MUST speak / read / write English.
>>
>> Curious thing is, most of the planet don't!
>>
>> In my experience, France, Italy, Spain are hors de combat! (Good old
>English
>> expression!)
>>
>> Of course there are those cynics who would point out that the UK and
>the USA
>> are 2 nations divided by a common language.
>>
>> And if you think this is bad, take a look at my reply to Vincent
>BADA....
>>
>> Regards,
>> Graham Naisbitt
>>
>> [log in to unmask]
>>
>> WEB: http://www.concoat.co.uk
>>
>> CONCOAT Ltd
>> Alasan House, Albany Park
>> CAMBERLEY GU15 2PL UK
>>
>> Tel: +44 (0) 1276 691100  Fax: +44 (0) 1276 691227
>
>>
>
>##############################################################
>TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
>##############################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following text
>in
>the body:
>To subscribe:   SUBSCRIBE TECHNET <your full name>
>To unsubscribe:   SIGNOFF TECHNET
>##############################################################
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
>information.
>If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
>847-509-9700 ext.5365
>##############################################################
>
>##############################################################
>TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
>##############################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
>the body:
>To subscribe:   SUBSCRIBE TECHNET <your full name>
>To unsubscribe:   SIGNOFF TECHNET
>##############################################################
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
>information.
>If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
>847-509-9700 ext.5365
>##############################################################
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2