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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Fri, 22 Jul 2016 17:30:49 +0000
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Or else you can look at the test methods for this in IPC-TM-650. You can also calculate this further using the methods listed in IPC-D-279 Design Standard.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bhanu Sood

Sent: Friday, July 22, 2016 11:55 AM

To: [log in to unmask]

Subject: Re: [TN] Thermal conduction of a plated TH



Some citations, also check iTherm proceedings



Li, R. S. "Optimization of thermal via design parameters based on an analytical thermal resistance model." Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM'98. The Sixth Intersociety Conference on. IEEE, 1998.



Mikic, B., and G. Carnasciali. "The effect of thermal conductivity of plating material on thermal contact resistance." Journal of Heat Transfer 92.3 (1970): 475-481.



Lau, John, ed. Thermal stress and strain in microelectronics packaging. Springer Science & Business Media, 2012.



Nakayama, Wataru, et al. "Heat Conduction in Printed Circuit Boards:

Part I—Overview and the Case of a JEDEC Test Board." ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2007.



Nakayama, Wataru, et al. "Heat Conduction in Printed Circuit Boards:

Part II—Small PCBs Connected to Large Thermal Mass at Their Edge."

ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2007.





Nakayama, Wataru, et al. "Thermal Characterization of High-Density Interconnects In the Form of Equivalent Thermal Conductivity." ASME

2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. American Society of Mechanical Engineers, 2009.



Nakayama, Wataru, et al. "Thermal characterization of high-density

interconnects: A methodolgy tested on a model coupon." Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. IEEE, 2010.





On Fri, Jul 22, 2016 at 11:43 AM, Theodore J. Tontis <[log in to unmask]> wrote:

> I am trying to locate any technical data on how to set up an experiment to measure the thermal dissipation of a plated TH to internal planes.

>

> I have an idea on how I would like to set up the experiment but wanted to see if I could use an existing experiment to compare my results against. The experiment should have some detail or coupon details that would allow me to recreate the samples to insure the process is set up correctly.

>

> Thank you in advance,

>

> Ted

>

> Theodore J. Tontis CPIM CID

> Sr Industrialization Engineer

> Office: 262-512-4885 x54885

> [log in to unmask]

> Rockwell Automation

> 6400 W Enterprise Dr, Mequon, WI 53092







--

Bhanu Sood

Tel: (202) 468-8449


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