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October 1999

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Subject:
From:
"Hamilton, Richard CLE 4454" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Oct 1999 08:51:15 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (63 lines)
Hello all,

I am experiencing some missing email and am trying to determine if the
problem is at my end or somewhere else.

How many emails with the above subject (minus the '- Sanity check') have you
received since the original subject was sent out at 10/5/99 3:29PM? That is
the Sent Time I show for the first one I received. I have only received two
others since that one and they both are like the one attached here, from Jon
Moore in replying to someone else's question. However I never saw the
'someone else's question' come through.

Please reply to me off line so I can begin to find the problem. By the way I
have suspected this recently but now I can actually pinpoint some
particulars.

Thanks for your help in advance.

Richard Hamilton
Clemar Mfg. / Rain Bird
[log in to unmask]

> -----Original Message-----
> From: Jon Moore [SMTP:[log in to unmask]]
> Sent: Wednesday, October 06, 1999 7:44 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Temporary Solder Mask
>
> In a message dated 10/6/99 8:04:50 AM US Eastern Standard Time,
> [log in to unmask] writes:
> >>SNIP<<...
> > In addition to what you are looking
> >  for, we are looking for a fast cure solder masking that is water
> >  soluble.  (Continuous flow is difficult to do if you must wait ten
> >  minutes for the masking to cure.)
>           ...>>SNIP<<
>
> Ryan,
>       Here is how I dealt with that issue, but it really only works if you
> have bottom side SMD's going through your wave process.  I put the temp
> solder mask on right after placing the bottom side SMD's, but before the
> cure
> oven for the SM adhesive.  That way the oven cured the adhesive and dried
> the
> mask thoroughly before the wave operation.
>
> Jon Moore
>

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