We have developed a process using our OPUS systems to selectively solder the
grounding junctions on parts like you describe.  The process uses either a
solder iron or laser depending on how much power it takes to reflow the
solder in the joint and overcome the heat sinking of the metal parts.

This approach also leaves any components that have been previously wave
soldered in place.

Scott J. McAnall
Robotic Process Systems, Inc.
www.rpstest.com
www.rpsrobot.com
www.rpssoldersyt.com
www.rpsautomation.com

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