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June 1999

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Subject:
Temp cycling and vibration testing.
From:
"<Charles Barker>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 10 Jun 1999 08:41:07 -0500
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text/plain
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text/plain (41 lines) 
Our Engineering depatment is doing some temperature cyclying and vibration
testing (HALT type testing). Can any or you tell where I can get reference
material about the effect this has on the solder joints? Some of the
variables I would like to become knowledgable about are: component height
and mass, joint design, solder alloy variations, effect of reflow profile,
etc.

We will probably be testing over a temp range of -60 to -65  C up to the
neighborhood of +125 C or thereabouts and shock maybe up to 40, 50 or 60
g's.

Are there any "programs" or formulae readily available which will predict
joint failure after so many cycles at certain temps, freqs, and g's?

TIA

Charlie Barker

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