Sounds like the old HydroSqueegee.  it leaves a flat finish on  an already
solder coated board but it's flat because most of the solder has been blown
off.  To my recollection of 20-25 years ago, the residual solder thickness
is about .05 to .1 mil.  barely more than the intermetallic.  Does not have
a great shelf life.

George Carroll
Process Engineer
Siemens Energy and Automation
Johnson City, TN

[log in to unmask]

-----Original Message-----
From: Genny Gibbard [mailto:[log in to unmask]]
Sent: Friday, November 09, 2001 12:27 PM
To: [log in to unmask]
Subject: [TN] Hot Oil


You learn something new (or new to you) every day.
I was just told of a board finishing process called Hot Oil Solder
Levelling.  It was portrayed as a very flat, nice finish.  I was also told
that it is old technology, which may be why I am not familiar with it.  It
is only within the last year that I have really gotten involved with
specifying board finishes.  I've been searching on the internet to learn
more and am a bit confused.
My questions:
Is Hot Oil Reflow and Hot Oil Surface Levelling the same thing?  If not,
what is the difference?
What are advantages/disadvantages to this over HASL, or any of the newer
so-called 'flat' finishes needed for fine pitch?

Thanks.

Genny Gibbard (mailto:[log in to unmask])

----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------