I had an operator speed up our solder mask cure process by not letting the
boards cool after uv exposure before exposing the opposite side of the board.

The heat triggered the curing mechanism before the adhesion mechanism
kicked in.

We really had fun trying to figure out why the solder mask kept coming
off the board.

The operator had very good intentions by wanting to speed up the process,
but didn't appreciate why there was a delay in between uv exposure to each
side

Susan Mansilla

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