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July 1998

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Subject:
Re: Base Materials
From:
Kwong Chin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 20 Jul 1998 09:12:45 -0400
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Hugh

You may want to include Insulated Metal Substrate (IMS),
such as the Bergquist Thermal-clad material.

K.K. Chin
Mfg Engg Manager
Artesyn Technologies
www.artesyn.com



From: Hugh Scott Miller <[log in to unmask]> AT NetMail on
      07/19/98 04:47 PM EDT

To:   [log in to unmask] AT NetMail@ccmail2
cc:    (bcc: KK Chin/NA/Artesyn)
Subject:  [TN] Base Materials






I am trying to construct a PCB supplier survey outlining all
base materials available.  Currently my list consists of:

Phenolic
Epoxy Paper
Epoxy Glass
Polyimide Composite
Polyimide Glass
Cyanate Ester
Flex Materials
Teflon
GETEK

Have I left anything out?  If so, please advise so that I
can make the necessary additions.  I would like to thank all
that participate for their time.

Best Regards

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