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June 2009

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 10 Jun 2009 08:17:47 -0500
Content-Type:
text/plain
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text/plain (1 lines)
It depends:   Loctite 384 & activator 7387 for some applications.



Victor,



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Fox, Ian

Sent: Wednesday, June 10, 2009 8:01 AM

To: [log in to unmask]

Subject: Re: [TN] Profiling compound?



Hi Iain, we always use high melting point solder (88Pb10Sn2Ag usually)



Regards

Ian Fox

Lead Materials and Process Engineer

Aero Engine Controls

A Rolls-Royce plc and Goodrich Corporation Joint Venture

 



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain (UK)

Sent: 10 June 2009 10:34

To: [log in to unmask]

Subject: [TN] Profiling compound?



Hi all,

 

What is the preferred medium for bonding thermocouples to boards for

PbFree thermal profiling - forced convection!

 

CIA,

    Iain



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