While working at a test lab, I did work on a report in which we identified
gold embitterment failures of CSP on gold plated boards. These had very
small solder connections. Generally, assembly shops do not need to be
concerned by ENIG finishes. But, electroplated gold could be made thick
enough to cause problems, especially in SMT applications.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Gregg A. Owens
Sent: Wednesday, December 01, 2004 2:23 AM
To: [log in to unmask]
Subject: [TN] Gold Plated Board


Dear TechNetters,

One of my students has a good question, I can't answer. J-STD-001
requires gold removal of various gold plated components/terminals. What
if you are using a gold plated board plating. Is there generally any
problems with gold embrittlement with this type of board plating with
non-gold plated leads for through-hole or SMT components?

Your thoughts would be most appreciated.

Gregg A. Owens
Manufacturing Technology Training Center, Inc.
Mira Loma, CA 91752 USA

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