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Subject:	Re: Solderability Testing of RF Shields
From:	David Douthit <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 8 Aug 2002 13:30:10 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (46 lines)

Bev,

What's wrong with pretinning these parts?

Are you worried about solerability or thermal profiles or both?

David A. Douthit
Manager
LoCan LLC

Bev Christian wrote:

> TechNetters,
> I would appreciate any advice you can give on how I should test these things
> for solderability. They are BIG (relative to SOIC20's or 0402's) and have a
> high thermal mass.  We have tried using a globule block and a solder bath
> with different physical orientations, dips times, etc., but have not been
> able to come up with a good set of parameters for doing this.  Any
> suggestions, short of the old "dip and look" of the mil standard?
>
> regards,
> Bev Christian
> Research in Motion
>
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