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August 1999

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Tue, 10 Aug 1999 09:29:10 +0200
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[TN] (44 lines)
 Wolfgang, I recommend you to by asap Harman's latest excellent and
indispensible book 'Wire Bonding in Microelectronics' from 1998.
ISBN0-07-032619-3 McGraw-Hill price USD65. See www.ee.mcgraw-hill.com.
We have tried som ViaSystems board for Al wire. You can't perform well
at random, but in all essential it works well. TWI/Cambridge/UK knows a
lot about the issue. I use to call Bob Clements at 44-1223-892 588. Good
Luck!/
Ingemar Hernefjord
Ericsson Microwave Systems



> Good Day
>
> Would appreciate any and all input on reliability data / experience /
> potential failuremodes when wirebonding Alu wire to electroless nickel
/
> immersion Gold boards.
>
> HiRel Automotive application
> wedgebonding
> ultrasonic wire bonding
> 10 mil AL wire
> Au 3 to 5 microns
>
> appreciate your response
>
> [log in to unmask]
>

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