Please give me your thoughts.
 
Hi to all Technetters,

 

Please give me your thoughts.

 

It has been the common practice in SMT industry that each line should

have a dedicated reflow oven to use.The printed circuit boards that we

manufacture are both SnPb and LF. We have 5 SMT lines that do not have

dedicated reflow ovens. We have some kind of space limitations in the

SMT area. 

 

The oven profiles that we have are generally one each for SnPb and LF.

But the issue is that we have different sizes of the boards, some with

R's and C's on the bottom side and the other boards may have active

components on top side going in the same oven. The other boards are

symmetrical in panelization that have to go in the same reflow ovens.

 

We established oven profiles that will "fit" to any of the boards but I

am feeling somewhat wary about the quality of the boards that come out

of the ovens. I am aware that different components have different

thermal expansion ratios and material strength characteristics. But I

think, we are doing more of a "guessing game" here. I wish our set-up

may need to be re-established in compliance to a good process.

 

Thanks for your help. I will appreciate it very much. 

 

Ernesto V. Rueda

SMT Process Engineer

Pelco, Inc.  

 

 

 





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