The thicknesses alluded to below are "in flux" (another way of saying 'changing'), they used to be as low as 50 uinches of Nickel, and the gold varies with who is doing the plating...but is nevermore than 10 uinches.
Rudy Sedlak
RD Chemical Company
"Stadem, Richard" <[log in to unmask]> wrote:
Electroless Nickel with Immersion Gold over it. Typically the nickel is
around 150-180 uinches, with gold thickness held between 5 and 10
uinches. This is changing, I think, to between 3 to 6 uinches of gold.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of jrm
Sent: Wednesday, October 12, 2005 12:23 PM
To: [log in to unmask]
Subject: Re: [TN] wire bonding
What is ENIG?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Wednesday, October 12, 2005 1:18 AM
To: [log in to unmask]
Subject: Re: [TN] wire bonding
Hi Kathy,
we have been using Al wedgebonding on ENIG for many years, from 37um
wires to 250um.
Works just fine.... if you have a reliable ENIG plater, of course.
Ingemar Hernefjord
Ericsson Microwave Systems
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kathy
Sent: den 11 oktober 2005 21:42
To: [log in to unmask]
Subject: [TN] wire bonding
Question for the assemblers:
When wirebonding to ENIG, do you use any solder paste or other
"facilitator"
to create the bond?
Thanks for your reply...
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