Dear Colleagues:

A new IPC document, IPC-7525, Stencil Design Guidelines, is now available for your review. This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesives.  The draft document is in the Official Representative Proposal stage and comments are welcomed from the industry until 14 January 2000.

To receive your electronic copy of the draft document, e-mail a command message as below to our auto-responder: -  
TO: [log in to unmask] 
SUBJECT: REQUEST IPC-7525
MESSAGE: Your name, company and contact details

THE SUBJECT LINE MUST READ EXACTLY SO AS IT SERVES AS COMMAND LINE.

The file is in Adobe Acrobat .pdf format and can be opened with the freeware Acrobat Reader version 3 or later (www.adobe.com).

All comments received are to be resolved during the next 5-21e Task Group meeting on 27 January 2000 in Tempe, AZ

If you would like more information about this document and the related activities, please do not hesitate to contact me.



Cordially,

Jane Koh
IPC Technical Project Coordinator
 
Voice:  (847) 790-5349
Fax:    (847) 509-9798
E-mail :     [log in to unmask]

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