In a message dated 10/28/99 6:01:41 AM US Eastern Standard Time,
[log in to unmask] writes:

> Contract Mfg. struggles with solder balls on chip caps.
>  We can't control the land patterns, but we can change the stencil.
>  Has anyone out there tried home plate shaped openings in the stencil
>  even though the lands are rectangular?

I have tried a couple of things, but had the best results with what we called
"reverse home plates - something like this ( with the terminations in the
open "V" end):

_  _
| \/ |
|_ _|

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