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October 2005

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Subject:
Re: Voids in BGAs, again
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 18 Oct 2005 15:55:15 EDT
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Hi Ioan,
I plan on giving parts 1 through 3   of my solder joint reliability workshop
series on December 5, 2005 in the Boston area [most likely New Hampshire] and
part 4 as part of the IPC/JEDEC American conferences will give me enough time.
I will be giving Parts 1 through 3 at APEX in Anaheim.
I will let you know the details about boston as soon as they are finalized.



Werner

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