Not that bad a question.  The answer is yes but not likely.  One of the
current trends in the industry is to use exotic rectification (periodic
pulses
of reverse current) to plate more in the holes than on the surface.

What is more likely though is you are seeing product which was plated
conventionally and then lost surface copper during operations subsequent

to plating.   Deburrers and surface finishing scrubbers all take off
surface copper.
HASL process can also remove copper if the dwell time in the solder pot
is too long.
The copper dissolves into the solder pot.

> -----Original Message-----
> From: sarah [SMTP:[log in to unmask]]
> Sent: Wednesday, July 29, 1998 9:27 AM
> To:   [log in to unmask]
> Subject:      [TN] Plating Thickness
>
> Hi everyone
>
> Please pardon me for my ignorance regarding this
> matter but I will ask this question anyway:
> - is it possible that the plating thickness on the board
>   surface is less than that of the T/H?
> - what might be the cause of this type of phenomenon?
> Any comments or information anyone could provide
> is highly appreciated.
> thanks
> Sarah
>

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