I do encountered problem as Ken. My problem more severe. There were pads breakout at
vias with more than 90deg (is a reject under IPC class 2&3) at both outer and inner
layers on a 10-layer board (with blind vias). These vias breakout only happen on the
blind vias. My design having these blind vias connecting between layer1-2 & 9-10. I was
calling for quality rejects, but my supplier strongly disagreed with my rejection as
they felt that all boards had passed through the flying probe test and they are very
confident its functionality and reliability. Does anyone agree with my vendor's view ?
Appreciate any comments and advise please.

Thanks and have a nice day.

"Stephen R. Gregory" wrote:

> In a message dated 10/12/99 5:51:38 PM Central Daylight Time, [log in to unmask]
> writes:
>
> > On one of our product, we have found that one of the inner layer has
> >  misregistration.
> >
> >  Do you see any quality/ long term reliability problem associated with inner
> >  layer misregistration? Our requirement was to have a 1 mil minimum annular
> >  ring on all inner layers. What is the risk cum liability of accepting those
> >  boards knowing that they are misregistered.
> >
> >  Misregistration occurred at 1mm BGA where the finished hole diameter is 9
> >  mil on a 20 mil pads.
> >
> >  re,
> >  ken patel
>
> Ken,
>
> As one who is learning, and one who has experienced some bare board problems
> recently, I would like to ask a question or two to clarify...
>
> 1. Are you seeing break-out? No complete anular ring at all, just partial?
>
> 2. What is the laminate material of the board? How many layers? Does this
> mis-registration violate any other minimum lines and spaces standards? Or is
> it just a problem of incomplete anular pads?
>
> Thanks,
>
> -Steve Gregory-
>
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