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Date: | Fri, 7 Mar 2008 17:36:44 +0100 |
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Ioan,
We have been bonding with heavywire Al wire to ENIG type a) hundreds of
thousands boards, works perfectly.
Au ball/wedge fine wire won't work with 6S confidence on any of a) or b)
because the gold is too thin.
http://www.empf.org/empfasis/2007/June07/wedge.html
Inge
-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Ioan Tempea
Skickat: den 7 mars 2008 14:06
Till: [log in to unmask]
Ämne: [TN] Bonding on ENIG
Hi Technos,
A connector has to be bonded on 2 mil wide traces. Is ENIG suited as a
surface finish for bonding? If yes, why, if not, why and if it depends, why?
Or otherwise said, I have a PCB that will get some SMT parts on both sides
and then a couple hundred golden fingers will see bonding. I was presented
with 2 options for the PCB finish:
a) Immersion Gold : 0.03um Au over 3um Ni over 25±10um Cu
b) ElectroBonding Gold: 0.3um Au over 3um Ni over 25±10um Cu
Which one is to prefer?
Thank you,
Ioan
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