Dear Sir,
I am having some more difficulties with your Survey Format ...
> Coatings
>
> Conformal
> Organic
> Paraxialine
> Solder
> OSP
What do you mean with this OSP ???
Is OSP Organic Surface Passivation or Paste ?
Does it double with "Organic" above
>
> Plating
>
> Copper
> Tin
> Tin/Lead
> Tin/Nickel
> Tin/Nickel Alloy
> Nick/Gold (Hard)
> Nick/Gold (Immersion)
> Nick/Rodium RHODIUM !
> Full Body Nickel
> Full Body Gold
> Selective Plating
> Palladium
> Palladium-Alloy
> Silver
> Bismuth
>
> Finishes
>
> Electroless Nickel Gold
> Immersion Silver
> Electroless Nickel
> Immersion Gold
What is the difference between Electroless Nickel Gold and Immersion Gold ?
> Electroless Palladium
> Brushed Tin Lead
> Electroless Tin
> Solder Fused
> Flux
> Roll Solder
> Tin/Lead Fused
> Triazode WHAT IS THIS ONE ?
> Entek
Thank you for clarifying all this
Very Best Regards
Roland
Henri Jaquet, Photochemie Group,
POB 770, CH-1212 GRAND-LANCY 1
GENEVA, SWITZERLAND
Tel. +41-22-884-3053 Fax. +41-22-794-3052
Email: [log in to unmask]
http://www.photochemie.ch
----------------------------------------------------------------
Dear Sir,
I have some questions regarding your Survey Format.
Here in Europe and more specifically to some European Designers /
Manufacturers it is probably not that standardized.
I did not see any mention of minimum clearance between drilled hole to
innerlayer conductor or power/ground plane ?
Is it because you assume that people are following a standard in this
regard ?
If yes which standard is the base and what is the minimum accepted
clearance for the PCB manufacturer ?
In the following, why would the Line to Land different from Line to Line ?
> Line-to-Line Clearance (internal)
> Line-to-Line Clearance (external)
> Line-to-Land Clearance (internal)
> Line-to-Land Clearance (external)
I don't get what you mean here with Automatic Test Fixture ?
> Electrical Testing
>
> Dedicated Test Fixture
> Automatic Test Fixture
I did not see Reel-to-Reel manufacturing ?
In Solder Mask, What do you call Image Transfer ?
Is it screen Solder Mask ?
What about Electrostatic Solder Mask ?
> Soldermask
>
> Dry Film
> Image Transfer
> LPI
Again Electrical Test
Clamshell ???
Continuity (spelling error) and what do you mean... it seems that you want
to know if continuity has been tested, but is it only adjacent or not ?
((Typical of FLying Probe Tests)).
What about Grid Test ?
What about E-Beam Test ?
I would put "Against" Net List
> Electrical Test
>
> Dedicated
> Clamshell
> Contiunity
> Flying Probe
> Net List
AOI - I would put it there and like to know if it is against Net List
Routing
I would see Laser Routing (In particular for Polyimides when doing first
articles, but not only..)
Thank you for your prompt answer
Very Best Regards
Roland
Henri Jaquet, Photochemie Group,
POB 770, CH-1212 GRAND-LANCY 1
GENEVA, SWITZERLAND
Tel. +41-22-884-3053 Fax. +41-22-794-3052
Email: [log in to unmask]
http://www.photochemie.ch
----------
> De : Hugh Scott Miller <[log in to unmask]>
> A : [log in to unmask]
> Objet : [TN] Supplier Survey Format Final Edition
> Date : dimanche, 26. juillet 1998 15:50
>
> Once again, I would like to thank all the people that have participated
> and volunteered their time to give me additional ideas specific to the
> content of my company's supplier survey form. Some of you have
> requested that I post the end result of this discussion, and I have
> gratefully. Below is the collective wisdom of several people in
> Technet, and if there are any last minute changes I should include,
> please speak now or forever hold your peace. Thanks again everyone.
>
> Supplier Survey
>
> Company Name
> Company Address1
> Company Address2
> Country
> Zip Code
>
> Telecommunications
>
> Telephone
> Fax Number
> Modem Number
> Email Address
> Web Site Address
>
> Personnel
>
> CEO
> Quality Manager
> Engineering Manager
> Sales Manager
> No of Employees
> # of Purchasing Personnel
> # of Engineering Personnel
> # of Quality Personnel
> # of Production Personnel
> # of Production Control/Distribution Personnel
> # of Tool Making/Maintenance Personnel
> # of Administrative Personnel
> # of Others
>
> Manufacturing Focus
>
> Min # of Layers
> Max # of Layers
> Min Line Width (internal)
> Min Line Width (external)
> Line-to-Line Clearance (internal)
> Line-to-Line Clearance (external)
> Line-to-Land Clearance (internal)
> Line-to-Land Clearance (external)
> Min. Hole Size
> Min. SMT Pitch
> Max. Panel Size
> Aspect Ratio
>
>
> Product Mix
>
> S/S (% of Capacity)
> D/S (% of Capacity)
> Multilayer 4-6 layers (% of Capacity)
> Multilayer 8 + layers (% of Capacity)
> Flex & Rigid Flex (% of Capacity)
>
> Basic Plant Data
>
> No. of Shifts
> # of Hours per Shift
> # of Work Days/Year
> # Work Days/Week
> # of Holidays and Vacations Days
> Total Sq' of Capacity per day
> Total SQ' of Capacity per Month
> Manufacturing area/Sq Feet
> Current % of Capacity being Used
> Sq Footage of Facility
> Plant Character (High Volume, Medium Volume, Low Volume, Prototype)
> Average Leadtime (Production Parts)
> Average Leadtime (First Article)
> SPC Program In-Place
> Customer Approvals
>
> Capacity Expansion Plans
>
> Current Capacity
> 6 Month Plan
> 12 Month Plan
> 24 Month Plan
>
> Design Capabilities
>
> Computer Aided Engineering & Equip
> Computer Aided Design & Equip
> Laser Plotter
> Version of Gerber
>
> Computer Aided Design Details
>
> ACCEL Technologies
> AutoCAD
> Best Proto
> Cadence
> CADint PCB
> Data I/O (Synario)
> HP RF Board Designer
> Intergraph
> McCAD
> Mentor Graphics
> MicroSim
> OrCAD
> PADS Software
> Protel
> Ultiboard
> VeriBest
> Viewlogic
> Visionics (EE Designer)
> Xynetics
> Zuken-Redak
>
> Electrical Testing
>
> Dedicated Test Fixture
> Automatic Test Fixture
>
> Special Technologies
>
> Blind Vias
> Buried Vias
> Microvia Rigid
> Microvia Flex
> Microvia-Laser
> Microvia-Plasma
> Photovia
> Carbon Ink
> COB
> BGA
> Backpanel
> Flexible
> Flex-Rigid
> IVH
> Hot Air Level
> Hot Oil Level
> RF Microwave
> Thin Core
> Buried Capacitance
> Buried Resistance
> Controlled Impedance
> Plugged Vias
>
> Processes
>
> Additive
> Semi-Additive
> Subtractive
> Thin Film
> Thin Foil
> Thick Film
>
> Base Materials
>
> Phenolic
> Glass Paper
> Epoxy Paper
> Epoxy Glass
> Polyimide Composite
> Polyimide Glass
> Cyanate Ester
> Flex Materials
> Teflon
> BT Epoxy
> PPE
> High performance epoxy
> PTFE
> RCC
> Polyimide
> Silicon/Glass
> Polyphenylene Ether/Glass
> Aramid fiber laminates-Woven
> Aramid fiber laminates-Paper
> Insulated Metal Substrate
> Glass Reinforced Hydrocarbon Ceramic Laminate
>
> Heat Sink/Stiffeners
>
> Copper-Invar-Copper
> Copper-Moly-Copper
> Copper-Carbon-Copper
> Aluminum
> Copper
> Aluminum-Silicon Carbide
> Beryllium
> Beryllium-Beryllium Oxide
> Aluminum-Beryllium
>
> Soldermask
>
> Dry Film
> Image Transfer
> LPI
>
> Drilling
>
> Small Hole
> Laser Drill
>
> Hard Tooling
>
> Blanking
> Pierce
>
> Routing
>
> NC Route
> Pin Route
> Perforate
> Laser Score
> V-Score
> Shear Only
>
> Electrical Test
>
> Dedicated
> Clamshell
> Contiunity
> Flying Probe
> Net List
>
> Coatings
>
> Conformal
> Organic
> Paraxialine
> Solder
> OSP
>
> Plating
>
> Copper
> Tin
> Tin/Lead
> Tin/Nickel
> Tin/Nickel Alloy
> Nick/Gold (Hard)
> Nick/Gold (Immersion)
> Nick/Rodium
> Full Body Nickel
> Full Body Gold
> Selective Plating
> Palladium
> Palladium-Alloy
> Silver
> Bismuth
>
> Finishes
>
> Electroless Nickel Gold
> Immersion Silver
> Electroless Nickel
> Immersion Gold
> Electroless Palladium
> Brushed Tin Lead
> Electroless Tin
> Solder Fused
> Flux
> Roll Solder
> Tin/Lead Fused
> Triazode
> Entek
>
> UL Approvals
>
> UL Single Sided
> UL Double Sided
> UL Multilayer
> Approv # of Layers
>
> International Approvals
>
> CSA
> IECQ
> ISO 9001
> ISO 9002
> ISO 9003
> ISO 14000
> QS-9000
> ESA (European Space Agency)
> VDE
>
> Raw Material Data
>
> Thin Laminate Suppliers
> Thick Laminate Suppliers
> Copper Foil Suppliers
> Prepreg Supplier
> Etchant Supplier
> Soldermask Supplier
>
> Basic Equipment Data
>
> # AOI Inspection Equipment
> # of Drilling Machines
> # of Plating Lines (Pattern/Panel/Tenting)
> # of Plating Lines (Nickel, Gold, etc)
> # of Routing Machines
> # of Punching Machines
> # of Scoring Machines
> # of Electrical Test Stations
> In-House Lamination
>
>
> Finanicial Data
>
> Terms: Net Days
> Currency:
> Dun & Bradstreet #
> Years in Business
> Annual Revenues
> % of Revenue Reinvested in Plant Annually
>
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