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Date: | Thu, 2 Feb 2006 08:31:47 -0500 |
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Buried vias should not need to be filled as the bonding material should adequate to fill these features to minimum standard.
If you as discussing the filling of thru-hole vias, I would recommend a Peters SD2795 and the investment in a planarization unit. Traditional scubbing is problematic and we have attempted using the Ishii Hyoki mechanical as well as a chemcut unit. The best process we have determined is using a Pola&Massa process to remove the surface epoxy as well as reduce the surface copper improved by the plating of the via prior to filling. Your Dave Hoover presented a great paper at SMTA/Dallas in 2004, where the various processes are discussed for via filling.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 37
Fax - 802.257.0011
<http://www.vtcircuits.com/>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Marcello Brett Malteze
Sent: Thursday, February 02, 2006 6:17 AM
To: [log in to unmask]
Subject: [TN] Via on Hole process
Hello all,
We are installing the via on hole process and iīm looking for more
informationīs regarding to Ink Supplier to fill the buried vias , someone
that could describe the flow process and if it is possible to run
planarization on a normal Scrubex machine not Ishiihyki.
Tks a lot,
Brett
Marcello Brett Malteze
Mechanical Process Engineering
Multek Brazil
Phone: + 55 11 3749 8384
Mobile: + 55 11 9468 4833
Skype: mbrett73
Email: [log in to unmask]
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