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August 1999

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Subject:
From:
"Goldman, Patricia J." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 18 Aug 1999 14:49:44 -0400
Content-Type:
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Remember, this reply was sent to Susan, with the 15-mil lines and 38-mil
holes and a major quality problem from her board supplier.  I thought of the
fine feature challenges and all you say is true with regard to them.
However, I focused just on Susan's problem with using AOI on such large
features really boiled down to getting the supplier to clean up their act
(read down through my previous reply to her commentary).

Patty
Patricia J. Goldman
PPG Industries, Inc.
412-492-5516
[log in to unmask]


-----Original Message-----
From: TPE Engineering TechNet [mailto:[log in to unmask]]
Sent: Wednesday, August 18, 1999 2:19 PM
To: [log in to unmask]
Subject: Re: [TN] Board Layout for AOI and LPI -Reply


I agree with Patricia whole heartedly. However, due to the
complexity of todays product, with lines and spaces going
down to 3/3 and less, it may also be time to take a look at
the requirements placed on our laminate and other material
suppliers. Small dents and epoxy spots (acceptable to IPC
requirements) on copper clad laminate which may not have
been an issue in the past on 10 mil lines and spaces, are
definately an issue with todays 3 mil and less technologies.

Ron Hayashi
1-858-695-2222
[log in to unmask]

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