I like it! - a lot. Now, will someone come up with a process to HASL tin
lead plated boards - cheaply, and get rid of the puddling. Dave Hillman
seems to have a way.

Earl Moon
----- Original Message -----
From: Phil Crepeau <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, September 14, 1999 7:55 AM
Subject: Re: [TN] Surface finishing


> hi,
>
> there's tin-lead plate and then there is tin-lead plate and fuse.  i
always
> thought that the fusing process enabled the discrete particles of tin and
> lead to alloy.  another advantage of the tin-lead plate and fuse is that
any
> dewetting and non-wetting problems stay at the fabricator's shop.
>
> phil crepeau
>
> -----Original Message-----
> From: Rudy Sedlak [mailto:[log in to unmask]]
> Sent: Tuesday, September 14, 1999 6:56 AM
> To: [log in to unmask]
> Subject: Re: [TN] Surface finishing
>
>
> The other big difference between Tin/Lead plating, and HASL, besides
> planarity (flatness) is shelf life/solderability.
>
> HASL is a true alloy, and has one of the better shelf lives of any surface
> finish.
>
> Tin/Lead plating is discrete crystals of Tin and Lead lying next to each
> other, and the tendency for galvanic corrosion is REAL high, so the Tin
> oxidizes fast, and may need to be cleaned before soldering.  And cleaning
up
> Tin on a finished board is extremely difficult.
>
> Rudy Sedlak
> RD Chemical
>
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