Well, not that my experience means anything, but I have never seen that
technique.
I would think silkscreen registration is poor relative to the small space
between fine-pitch pads, and even a slight error will screw up your
assembly/soldering.

I would like to know where that article was published,
or hear from others who do it successfully.

Jack
(my employer stands behind every opinion I have.... <grin>)


                -----Original Message-----
                From:   Roberto Torres [mailto:[log in to unmask]]
                Re: Silkscreen feature in between fine pitch

                No one else uses the below mentioned silkscreen technique?

                On Wednesday, June 02, 1999 10:52 AM, Mike Gish Wrote:

                                I just finished reading an article that
described adding
                silksreen
                                features in between pads on fine pitch
components to create
                an
                                additional solder barrier between pads.
Does anyone have
                any experience
                                doing this?

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