Hi Stacy,
First, get your self a copy of IPC-7530 "Guidelines for Temperature Profiling 
for Mass Soldering Processes (Reflow & Wave)."
Second, part of your problem is the sloppy language that is being used in our 
industry.
What you are referring to as "reflow profiles" are actually "oven recipes." A 
given 'oven recipe' on a given machine will result in many differrent 'reflow 
profiles' at the solder joints of components with different thermal masses 
and construction. You definitely want to have a 'reflow profile' for each 
assembly code based on the component in the assembly with the solder joints 
heating up the slowest. To achieve this 'reflow profile' for a code may 
require a different 'oven recipes' for each of your reflow ovens--you will 
know this only after monitoring the 'profiles' resulting from a given 
'recipe' for these diffent codes.
Third, the number of your 'recipes' sure does sound excessive. 
Fourth, "above 183: 40-80 sec" is irrelevant. You need to be at least about 5 
seconds above (Liquidus for you solder + 25°C) [that is 208°C for eutectic 
Sn/Pb] for any solder joint in your assembly to assure proper wetting on a 
consistent basis. 
Fifth, remember, the object of the whole excercise is to make sure ALL solder 
joints in an assembly receive adequate heat during reflow.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com 

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