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October 2005

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Subject:
From:
Marcel van den Berk <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Marcel van den Berk <[log in to unmask]>
Date:
Fri, 14 Oct 2005 10:19:49 +0200
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Hello Richard,

Many thanks for your advice !


Best Regards,
----------------------------------------------------
Marcel van den Berk


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
Sent: donderdag 13 oktober 2005 20:05
To: [log in to unmask]
Subject: Re: [TN] solderjoint reliability

I am assuming that the live temperature cycling while powered up in the
service cycle could be treated as the same as cycling to failure for
reliability determinations.
For that reason, I suspect you can find the answers to your questions in
MIL-HDBK-001. Look at the reliability calculation methods outlined
(about) from page 24 through 50 in there. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Marcel van den Berk
Sent: Thursday, October 13, 2005 7:43 AM
To: [log in to unmask]
Subject: [TN] solderjoint reliability

Hello Guys,
 
Is there some one who can help me with my reliability question :
 
We have a board with 15 throughhole NTC components with a constant load
of 6 amps. The operating temperature of the NTC is about 180degrees
Celcius measured with a thermal camera on the comp body. The temperature
on the solder joint is about 100 - 120 degrees Celcius, also measured
with a thermal camera.
 
Questions: 
 
1) What is the maximum operating temperature on a solder joints for a
reliable contact ? so there is no degradation of the solder joint after
a long periode of time (10years)
2) Is there some literature where i can find some answers on this
question? IPC doesn't say anything about this... or i'm wrong?
 
Best Regards,
------------------------------------------------------------------------
----
Marcel van den Berk
DFM Support / PCB Technology / Board layout Electronic
DEVelopment------------PRoduction Standards group 
             
A.S.M.L.
De Run 6665
p.o.box 324
5504 DT Veldhoven
The Netherlands
E-mail:        [log in to unmask]
Internet:      http://www.asml.com <http://www.asml.com/> 
------------------------------------------------------------------------
----
  
 


-- 

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visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
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-- 

The information contained in this communication and any attachments is confidential and may be privileged, and is for the sole use of the intended recipient(s). Any unauthorized review, use, disclosure or distribution is prohibited. If you are not the intended recipient, please notify the sender immediately by replying to this message and destroy all copies of this message and any attachments. ASML is neither liable for the proper and complete transmission of the information contained in this communication, nor for any delay in its receipt.

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