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March 2001

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Subject:
From:
"Furrow, Robert Gordon (Bob)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 15 Mar 2001 14:55:11 -0500
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Matt,

I would be more conservative with the placement of the larger size
capacitors, and keep them significantly further from the edge. It doesn't
take much stress to induce internal fractures.

Thanks,
Robert Furrow
Printed Wiring Board Engineer
Strategic Supply Global Account Manager
Supply Chain Networks
Lucent Technologies
978-960-3224    [log in to unmask]

> -----Original Message-----
> From: Matt Sanders [SMTP:[log in to unmask]]
> Sent: Wednesday, March 14, 2001 10:11 PM
> To:   [log in to unmask]
> Subject:      [TN] v-groove (score and break) depanelization
>
> Hello,
>
> I searched through the archives, but couldn't find much in the way of
> specifics (although a few good summaries of positives and negatives of the
> processes). We're looking to use score and break depanelization on a new
> product, and I was interested in finding out what design rules people are
> using.
>
> Our CEM tells us .040" from board edge to component body and .020" to
> traces
> or pads when we use a "pizza cutter" type depanelization machine as this
> process doesn't cause too much stress on the board. Is this consistent
> with
> what others have used, and have the results been successful? Is this
> "pizza
> cutter" a standard tool that assembly shops have?
>
> What rules are used when just hand breaking the boards with a v-groove.
> How
> about with a breakaway tab ("mouse bite")?
>
> My main concern is not inducing any excess stress on the board or cracking
> any components/joints.
>
> Thanks for the assistance!
> Matt
>
> ~~~~~
> Matt Sanders - Trimble Navigation, Component Technologies
> [log in to unmask] <mailto:[log in to unmask]>
> Phone: 408.481.7965
> Fax: 408.481.2202
> Pager: 408.619.3899
>
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