The lead material of the component according to the drawings is Matte
Tin over Nickel flash. The alloy being used to attach is Sn/ Pb 63/37
standard eutectic. George - I experimented with the components,
soldering a few of them with and without lead forming. Inspection under
a scope at 20X they look very similar without much deviation from one to
the other. So my belief is that the forming of the lead is not causing
this soldering anomaly.

Thank You,

Chris



Chris Schaefer
Suntron Corporation
Process Engineer

800 N. Brutscher Street
Newberg, OR 97132
Work Phone: 503.554.6270
Cell Phone: 785.248.9016
Email: [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Friday, December 28, 2007 12:44 PM
To: [log in to unmask]
Subject: Re: [TN] Hand Soldering Matte Tin over Nickel Flash with SnPb
Alloy

Hi Chris,
You do not say what the lead material is.
If the lead material is not solderable, the Ni flash may be too thin or
crack on lead forming.
Matte tin also may not prevent deterioration of the solder ability of
the Ni.
This whole arrangement is not optimum for good solder joints.



Werner



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